Memory Module Sale Made: Dense-Pac Microsystems Inc....

Memory Module Sale Made: Dense-Pac Microsystems Inc. said Tuesday that it won a $675,000 contract from an unidentified company for its memory modules, which pack electronic chips densely by stacking them on top of each other like pancakes.

The Garden Grove-based company said the modules will be used in an aircraft electronics project over the next year. The firm also said it is in the final stages of developing a second generation of its chip stacking technology.