Dense-Pac Receives $1-Million Modules Order

Dense-Pac Microsystems Inc. said Tuesday that it received a $1-million order from an unidentified aerospace customer to produce three-dimensional modules used to pack computer chips into tiny spaces.

William Stowell, chief financial officer, declined to identify the customer, citing competitive concerns.

Dense-Pac competes with Irvine Sensors Corp. in Costa Mesa, which has also developed a method for stacking dozens of computer chips.