TECHNOLOGY - June 1, 1995
Compiled by Ross Kerber, Times staff writer. He can be reached via the Internet at "kerberr@news.latimes.com"
Chip Order: Dense-Pac Microsystems Inc. in Garden Grove said Wednesday that it has won a $1.2-million order to make thin computer chips that can be stacked on top of each other so they use less space in electronic assemblies.
The identity of the customer, a military equipment maker, could not be disclosed, Dense-Pac executives said. The company’s chips are designed for portable computers, missiles, cellular telephones and other applications in which space is small.
