Dense-Pac Microsystems Gets $668,000 Order

GARDEN GROVE — Dense-Pac Microsystems Inc. said Tuesday it received a $668,000 purchase order for its three-dimensional stackable memory product from airplane maker GEC-Marconi Avionics Inc., a unit of General Electric PLC.

The company said the product will be used for new high-density avionics instrumentation and an upgrade for an undisclosed aircraft instrument.

Dense-Pac, which designs and makes computer chip stacking technologies, had about $10.6 million in sales for the nine months ended Nov. 30.