Dense-Pac Restructures Debt

Dense-Pac Microsystems Inc., a maker of semiconductor components, said Wednesday that it has restructured its debt to renew its line of credit through August, 1991.

The Garden Grove company also renegotiated a $1.2 million loan that provides for a 10-year payment period instead of three years in the original loan agreement.

Dense-Pac also sold $350,000 worth of company stock at a price of 35.25 cents per share to four affiliated European venture capital firms.