Dense-Pac to Make Device for IBM
GARDEN GROVE —
Dense-Pac Microsystems Inc. has signed a contract with IBM for an undisclosed amount to produce a series of high-density memory products.
Dense-Pac manufactures technology for stacking computer chips, which allows a large amount of memory to be packed into a small space.
The device being built for IBM, dubbed the “M-Densus,” will fit into Big Blue’s line of desktop-compatible mainframes. The device is designed to save space and provides better performance for the computer system, company officials said.
A spokesman for Dense-Pac declined to say how many devices the company will make, or how much IBM is paying for the product.
