Dense-Pac Signs Deal

Garden Grove-based Dense-Pac Microsystems Inc. said Tuesday that it has signed a contract with Toshiba America Electronic Components for an undisclosed amount to produce a series of high-density memory products.

Dense-Pac makes technology for stacking computer chips, which allows a large amount of memory to be packed into a small space. Toshiba America Electronic Components, based in Irvine, handles PC engineering, manufacturing and sales for Toshiba Corp.’s North America market.

The deal, which has been in the works for several months, will allow Toshiba to use Dense-Pac’s technology in various high-end computer products.